Samsung Electronics is expected to announce mass production of 3-nanometer semiconductors next week, sources said on Wednesday, beating its foundry rival TSMC in the advanced chipmaking process.
The next-generation 3nm chips will be built on Gate-All-Around (GAA) technology, which Samsung has said will allow for up to 45 percent area reduction while providing 30 percent more performance and 50 percent less power consumption . current process.
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The South Korean tech giant demonstrated its 3nm chips to US President Joe Biden last month when he visited Samsung’s semiconductor facility, Yonhap news agency reported. TSMC, the world’s largest contract chip maker, said it would begin mass production of 3nm chips in the second half of the year.
The two companies are in fierce competition to outperform each other by bringing the most advanced and efficient chips to the mass market and to win customers for contract chip manufacturing.
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Samsung, the world’s largest memory chip maker and second largest foundry company, has said that its 2nm process node was in the early stages of development, with mass production planned for 2025. According to industry tracker TrendForce, TSMC took a 53.5 percent share. The global foundry market in the first quarter of this year, followed by Samsung with 16.3 percent.
In 2019, Samsung unveiled a massive $151 billion investment plan in the logic chip and foundry sectors by 2030, as the tech giant looks to expand its leadership beyond the memory business.
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